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dc.contributor.authorStephen, A.en
dc.contributor.authorDunn, G. M.en
dc.contributor.authorOxley, C. H.en
dc.contributor.authorGlover, Jamesen
dc.contributor.authorMontes, Miguelen
dc.contributor.authorCumming, D. R. S.en
dc.contributor.authorKhalid, A.en
dc.contributor.authorKuball, M.en
dc.date.accessioned2013-08-07T13:49:28Z
dc.date.available2013-08-07T13:49:28Z
dc.date.issued2013-07-30
dc.identifier.citationStephen A. et al. (2013) Improvements in thermionic cooling through engineering of the heterostructure interface using Monte Carlo simulations. Journal of Applied Physics, 114 (4), pp. 043717en
dc.identifier.issn0021-8979
dc.identifier.urihttp://hdl.handle.net/2086/8852
dc.description.abstractA self-consistent Ensemble Monte Carlo (EMC) model was developed to simulate the thermionic effect in heterostructure barrier coolers. The model was validated on an InGaAs-InGaAsP heterostructure device of variable barrier height and width, producing good quantitative agreement with previous literature results. The operation of the cooler was found to be a complex and intricate process depending on the field, conduction band and details of barrier structure. When applied to a GaAs-AlGaAs micro-cooler there was good agreement with the experimental results. Importantly, very small alterations in the barrier structure were found to lead to considerable changes in device performanceen
dc.language.isoenen
dc.publisherAIP Publishing LLCen
dc.titleImprovements in thermionic cooling through engineering of the heterostructure interface using Monte Carlo simulationsen
dc.typeArticleen
dc.identifier.doihttp://dx.doi.org/10.1063/1.4817087
dc.researchgroupCentre for Electronic and Communications Engineeringen


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