Show simple item record

dc.contributor.authorChoi, Y. K.en
dc.contributor.authorCollop, Andyen
dc.contributor.authorAirey, G. D.en
dc.contributor.authorElliott, R. C.en
dc.contributor.authorWilliams, J. T.en
dc.contributor.authorHeslop, M. W.en
dc.identifier.citationChoi, Y.K., Collop, A.C., Airey, G.D., Elliott, R.C., Williams, J., Heslop, M.W. (2002) Assessment of the durability of high modulus base (HMB) materials. 6th International Conference on the Bearing Capacity of Roads, Railways and Airfields, Lisbon, Portugalen
dc.titleAssessment of the durability of high modulus base (HMB) materialsen
dc.researchinstituteInstitute of Artificial Intelligence (IAI)en

Files in this item


There are no files associated with this item.

This item appears in the following Collection(s)

Show simple item record