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dc.contributor.authorJones, Jason B.en
dc.contributor.authorWimpenny, D. I. (David I.)en
dc.contributor.authorChudasama, Rupeshen
dc.contributor.authorGibbons, G. J. (Greg)en
dc.date.accessioned2012-07-09T15:27:29Z
dc.date.available2012-07-09T15:27:29Z
dc.date.issued2011-08
dc.identifier.citationJones, J. B., Wimpenny, D. I., Chudasama, R. and Gibbons, G. J. (2011) Printed Circuit Boards by Selective Deposition and Processing. 22nd Solid Freeform Fabrication Symposium, 8-10 Aug 2011, Austin, TX, USA. Austin, TX, USA: University of Texas, pp. 639-656.en
dc.identifier.urihttp://hdl.handle.net/2086/6323
dc.description.abstractWith electronic applications on the horizon for AM, comes the dilemma of how to consolidate conductors, semi-conductors, and insulators in close proximity. To answer this challenge, laser printing (selective deposition) was used in tandem with fiber laser consolidation (selective processing) to produce PCBs for the first time. This combination offers the potential to generate tracks with high mechanical integrity and excellent electrical conductivity (close to bulk metal) without prolonged exposure of the substrate to elevated temperatures. Herein are the findings of a two-year feasibility study for a “one-stop” solution for producing PCBs (including conductive tracks, dielectric layers, protective resists, and legends).en
dc.description.sponsorshipTechnology Strategy Boarden
dc.language.isoenen
dc.publisherUniversity of Texasen
dc.subject3D Printingen
dc.subjectdigital fabricationen
dc.subjectAdditive Manufacturingen
dc.subjectprinted electronicsen
dc.titlePrinted Circuit Boards by Selective Deposition and Processingen
dc.typeConferenceen
dc.researchgroupAdditive Manufacturing Technology Groupen
dc.peerreviewedYesen


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