Printed Circuit Boards by Selective Deposition and Processing
With electronic applications on the horizon for AM, comes the dilemma of how to consolidate conductors, semi-conductors, and insulators in close proximity. To answer this challenge, laser printing (selective deposition) was used in tandem with fiber laser consolidation (selective processing) to produce PCBs for the first time. This combination offers the potential to generate tracks with high mechanical integrity and excellent electrical conductivity (close to bulk metal) without prolonged exposure of the substrate to elevated temperatures. Herein are the findings of a two-year feasibility study for a “one-stop” solution for producing PCBs (including conductive tracks, dielectric layers, protective resists, and legends).
Citation : Jones, J. B., Wimpenny, D. I., Chudasama, R. and Gibbons, G. J. (2011) Printed Circuit Boards by Selective Deposition and Processing. 22nd Solid Freeform Fabrication Symposium, 8-10 Aug 2011, Austin, TX, USA. Austin, TX, USA: University of Texas, pp. 639-656.
Research Group : Additive Manufacturing Technology Group
Peer Reviewed : Yes