Printed Circuit Boards by Selective Deposition and Processing

De Montfort University Open Research Archive

Show simple item record Jones, Jason B. en Wimpenny, D. I. (David I.) en Chudasama, Rupesh en Gibbons, G. J. (Greg) en 2012-07-09T15:27:29Z 2012-07-09T15:27:29Z 2011-08
dc.identifier.citation Jones, J. B., Wimpenny, D. I., Chudasama, R. and Gibbons, G. J. (2011) Printed Circuit Boards by Selective Deposition and Processing. 22nd Solid Freeform Fabrication Symposium, 8-10 Aug 2011, Austin, TX, USA. Austin, TX, USA: University of Texas, pp. 639-656. en
dc.description.abstract With electronic applications on the horizon for AM, comes the dilemma of how to consolidate conductors, semi-conductors, and insulators in close proximity. To answer this challenge, laser printing (selective deposition) was used in tandem with fiber laser consolidation (selective processing) to produce PCBs for the first time. This combination offers the potential to generate tracks with high mechanical integrity and excellent electrical conductivity (close to bulk metal) without prolonged exposure of the substrate to elevated temperatures. Herein are the findings of a two-year feasibility study for a “one-stop” solution for producing PCBs (including conductive tracks, dielectric layers, protective resists, and legends). en
dc.description.sponsorship Technology Strategy Board en
dc.language.iso en en
dc.publisher University of Texas en
dc.subject 3D Printing en
dc.subject digital fabrication en
dc.subject Additive Manufacturing en
dc.subject printed electronics en
dc.title Printed Circuit Boards by Selective Deposition and Processing en
dc.type Article en
dc.type Conference en
dc.researchgroup Additive Manufacturing Technology Group en
dc.peerreviewed Yes en

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