Measured thermal images of a Gallium arsenide power mmic with and without RF applied to the input

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dc.contributor.author Oxley, C. H. en
dc.contributor.author Coaker, B. M. en
dc.contributor.author Priestley, N. en
dc.date.accessioned 2008-11-24T14:02:25Z
dc.date.available 2008-11-24T14:02:25Z
dc.date.issued 2003-02-01 en
dc.identifier.citation Oxley, C.H., Coaker, B.M. and Priestly, N. (2003) Measured Thermal Images of a Gallium Arsenide Power mmic with and without RF applied to the input. Solid-State Electronics, 47(4), pp. 755-758.
dc.identifier.issn 0038-1101 en
dc.identifier.uri http://hdl.handle.net/2086/296
dc.description.abstract A gallium arsenide microwave monolithic integrated circuit (MMIC) power amplifier (M/ACom type MAAM71100) has been measured using infra-red microscope technology, with and without the application of a RF input signal. A reduction of approximately 10 °C in chip temperature was observed with the application of a RF input signal, which will influence the MTTF of the chip. Further, the measurement technique may be used to monitor the thermal impedance and dynamic cooling of RF power devices under operational conditions in complex circuits.
dc.language.iso en en
dc.publisher Elsevier en
dc.subject RAE 2008
dc.subject UoA 24 Electrical and Electronic Engineering
dc.title Measured thermal images of a Gallium arsenide power mmic with and without RF applied to the input en
dc.type Article en
dc.identifier.doi http://dx.doi.org/10.1016/S0038-1101(02)00356-8 en
dc.researchgroup Centre for Electronic and Communications Engineering


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